| 摘要 |
PROBLEM TO BE SOLVED: To provide an electric copper plating solution analysis device capable of more accurately and quantitatively managing a state of an electric copper plating solution containing additives using a constant current electrolysis method.SOLUTION: An electric copper plating solution analysis device 10, which analyzes an electric copper plating solution 13 containing additives including a promoter, an inhibitor and a leveler, comprises an analyzing container 12, a working electrode 18, a reference electrode 19, a counter electrode 21, a rotation driving part 23, a current generating part 26, a potential measuring part 28, and an analysis part 31. The analysis part 31 calculates parameters representing conditions of the electric copper plating solution 13 and specifies the conditions of the electric copper plating solution 13, based on a reaction mechanism in which Cu(I) produced on a surface of the working electrode 18 substitutes the inhibitor positioned on the surface of the working electrode 18, the leveler substitutes the Cu(I) positioned on the surface of the working electrode 18, and the Cu(I) forms a complex with at least the promoter to exhibit a promotion effect.SELECTED DRAWING: Figure 1 |
