发明名称 CONDUCTIVE PASTE
摘要 PROBLEM TO BE SOLVED: To provide a conductive paste having excellent conductivity.SOLUTION: A conductive paste comprises a conductive filler, and a binder resin, where a contact angle of water droplets with respect to the binder resin is 45 degrees or more and 70 degrees or less.SELECTED DRAWING: None
申请公布号 JP2016115561(A) 申请公布日期 2016.06.23
申请号 JP20140253753 申请日期 2014.12.16
申请人 SEKISUI CHEM CO LTD 发明人 ISHII MASAHIRO;ONISHI SHIGEKATSU;NAKASUGA AKIRA;NOZATO SEIJI
分类号 H01B1/22;B22F1/02;C22C9/00;C22C9/06;H01B1/00;H05K1/09 主分类号 H01B1/22
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