| 摘要 |
In sputtering processing that employs an anti-adhesion member comprising a sprayed film formed on the surface, this sputtering method reduces impurities included in a film deposited on a substrate, improving device characteristics of functional devices that contain said film; also provided is a functional device manufacturing method. An anti-adhesion member is provided with a base material, a sprayed film formed on the base material, and a diffusion-preventing film formed on the sprayed film, and deposition is performed on a substrate by sputtering processing in a state in which the anti-adhesion member is arranged inside of the processing chamber. The diffusion preventing film has the role of preventing impurities such as Na and Al present on the surface of the base material or contained in the sprayed film from diffusing into the substrate processing space. |
