INTERPOSERS AND FABRICATION METHODS THAT USE NANOPARTICLE INKS AND MAGNETIC FIELDS

摘要

Interposer circuitry (130) is formed on a possibly sacrificial substrate (210) from a porous core (130′) covered by a conductive coating (130″) which increases electrical conductance. The core is printed from nanoparticle ink. Then a support (120S) is formed, e.g. by molding, to mechanically stabilize the circuitry. A magnetic field can be used to stabilize the circuitry while the circuitry or the support are being formed. Other features are also provided.

主权项

1. A manufacturing method comprising:
(1) forming at least part of interconnection circuitry, said at least part of the interconnection circuitry comprising a core portion and an electrically conductive layer overlaying at least part of the core portion and substantially conforming to the core portion, wherein forming the at least part of the interconnection circuitry comprises:
depositing ink onto a substrate, the ink comprising conductive nanoparticles carried by a non-gaseous fluid carrier, the conductive nanoparticles joining together to form the core portion, the core portion comprising one or more elongated segments above the substrate; andforming the electrically conductive layer over at least said part of the core portion to increase the electrical conductance of at least one conductive feature, the electrically conductive layer covering an entire longitudinal surface of each elongated segment; (2) forming a support that fills, at least up to a level above each elongated segment, a region above the substrate around each elongated segment, the support not completely covering said at least part of the interconnection circuitry to allow at least each elongated segment to be electrically contacted from above the support; wherein the interconnection circuitry comprises one or more electrically conductive features passing through the support to interconnect circuits from a first side of the support to a second side of the support.