| 摘要 |
PROBLEM TO BE SOLVED: To provide a composition for polishing capable of polishing an elemental silicon with a higher polishing speed.SOLUTION: The composition for polishing used for polishing an object to be polished containing a single substance silicon and a silicon-containing compound other than the elemental silicon includes abrasive-grains and a dispersant. The number of silanol groups per unit area of the abrasive-grains is greater than 0 units/nmand less than or equal to 2.0 units/nm.SELECTED DRAWING: None |
