| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a wiring board in which a conductive circuit having excellent conductivity is accurately formed on an insulation substrate having a though-hole.SOLUTION: In an insulation substrate having a through hole provided therein and a backing substrate which is stuck to one surface thereof, after copper paste containing copper powder is coated on the internal wall surface of the through-hole from the surface opposite to the backing substrate and dried thereon to form a copper powder containing coated film, and the backing substrate is peeled off, heat treatment owing to superheated steam is applied to form a conductive coated film, thereby capable of efficiently manufacturing a wiring board having excellent characteristics.SELECTED DRAWING: None |
