| 摘要 |
PROBLEM TO BE SOLVED: To achieve a bump junction suppressing a short-circuit failure between bumps adjacent to each other in forming a fine-pitch electrode of a sensor element and a semiconductor element.SOLUTION: A bump structure of the present invention includes a columnar bump provided on an electrode via a shielding metal layer, and a metal coating covering side faces of the columnar bump. The metal coating has a component of the shielding metal layer, and the top face of the metal coating is on the same plane as the top face of the columnar bump.SELECTED DRAWING: Figure 1 |
