| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface mounting electronic component capable of effectively preventing a short-circuit between electrodes, which easily occurs when an electronic component having electrodes arranged on a bottom surface of a planar package with short distances is bonded on a wiring pattern of a printed board by soldering, and having a package structure which enables manufacture in a batch. SOLUTION: This surface mounting electronic component has a plurality of external electrodes 24 on a package bottom surface 23 so as to be connected on a printed board by soldering. A package 22 has a structure obtained by laminating a plurality of sheet materials integrally. The package bottom surface has a planar surface 23a provided with the plurality of external electrodes and recessed portions 23b positioned between adjacent external electrodes. All the sheet materials constituting the package are structured such that one basic sheet material can be constructed by connecting a plurality of them.
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