| 摘要 |
PROBLEM TO BE SOLVED: To provide a dust-collecting device that has sufficient dust collection capability, and at the same time can easily suck and convey a semiconductor device. SOLUTION: When machining such as cutting and forming is made to a semiconductor device 4 in a first die 2 or the like, an air take-in switching device 10 breaks the communication between the inside of piping 6 and the fresh air, and supplies dust collection pressure that is generated in a dust collection motor 5 to each die as it is for reliably collecting burr rubbish 9. On the other hand, when a conveyance unit 7 sucks and conveys the semiconductor device 4 at the part between the first die 2 and a second die 3, or the like, the air take-in switching device 10 allows the inside of piping 6 to communicate with the fresh air, and approaches the dust collection pressure that is generated in the dust collection motor 5 to atmospheric pressure for supplying to each die, thus easily sucking and conveying the semiconductor device 4 by the conveyance unit 7.
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