| 摘要 |
PROBLEM TO BE SOLVED: To obtain an equipment for inspecting each of a plurality of IC chip groups on an IC wafer in which maintenance and replacement of a protective resistor upon damage are facilitated while making thin the entire equipment by decreasing the number of signal lines and facilitating insertion of the protec tive resistor into the branch wires of each IC chip. SOLUTION: The inspection equipment of IC wafer comprises an inspection circuit board 4 for communicating a signal with an IC chip 7 group, a common wiring board 3 having a main common signal line 8 for connecting a tester body 1 with the inspection circuit board 4 for each group, and a resistor array board 11 having a large number of protective resistors R. The resistor array board 11 is interposed between the inspection circuit board 4 and a common wiring board 3 such that the surface of each board faces each other. Each protective resistor R touches, at one end thereof, the inspection circuit board 4 on one surface of the resistor array board 11 and touches, at the other end thereof, the common wiring board 3 on the other surface of the resistor array board 11.
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