发明名称 DIELECTRIC COMPOSITE MATERIAL
摘要 A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
申请公布号 US2007085212(A1) 申请公布日期 2007.04.19
申请号 US20060558163 申请日期 2006.11.09
申请人 3M INNOVATIVE PROPERTIES COMPANY 发明人 MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B.
分类号 H01L23/52;C08L65/00;H01L23/498;H05K1/03;H05K3/46 主分类号 H01L23/52
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