发明名称 |
DIELECTRIC COMPOSITE MATERIAL |
摘要 |
A dielectric composite material containing a toughened benzocyclobutene resin and at least about 50% by weight of an inorganic filler. Also electronic packages having at least one conductive layer and at least one layer of the dielectric composite material. The dielectric composite material can have a dielectric constant less than about 3.5, and a dielectric loss of less than about 0.004.
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申请公布号 |
US2007085212(A1) |
申请公布日期 |
2007.04.19 |
申请号 |
US20060558163 |
申请日期 |
2006.11.09 |
申请人 |
3M INNOVATIVE PROPERTIES COMPANY |
发明人 |
MAO GUOPING;QU SHICHUN;LI FUMING B.;CLOUGH ROBERT S.;O'BRYAN NELSON B. |
分类号 |
H01L23/52;C08L65/00;H01L23/498;H05K1/03;H05K3/46 |
主分类号 |
H01L23/52 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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