| 摘要 |
<p>The component has multiple power assemblies (2, 3) and control assembly (4), which control the assemblies (2, 3). The assemblies (2, 3, 4) are contacted by bonding wires (211-2110, 23, 24) of different thickness. Upper surfaces of the bonding wires (23, 24) serve as contact surface for the bonding wires (211, 213), respectively. The bonding wires serving as the contact surface are thicker than the contacted bonding wires.</p> |
