DRIVER MODULE STRUCTURE

摘要

Disclosed is a driver module structure comprising a flexible substrate (2) provided with a wiring pattern (7), a semiconductor device mounted on the flexible substrate (2), and a conductive heat-dissipating body (4) joined to the semiconductor device. The wiring pattern (7) includes a ground wiring pattern (8), and the flexible substrate (2) is provided with a hole (9) through which a part of the ground wiring pattern (8) is exposed. The exposed ground wiring pattern (8) and the heat-dissipating body (4) are electrically connected through a member (11) fitted in the hole (9).