发明名称 |
WAFER GROUP, AND DEVICE AND METHOD FOR MANUFACTURING WAFER |
摘要 |
PROBLEM TO BE SOLVED: To provide a wafer group that can easily form products with uniformity when there is variations in compositions of the wafers, and a technique of highly precisely and certainly forming an OF (orientation flat) by removing uncertainties in forming the OF.SOLUTION: There are provided a wafer group formed of 70 or more wafers, which each have an OF with an OF orientation precision within a range of ±0.010° and are obtained from the same ingot, and a technique relating to the wafer group.SELECTED DRAWING: Figure 3 |
申请公布号 |
JP2016119335(A) |
申请公布日期 |
2016.06.30 |
申请号 |
JP20140256502 |
申请日期 |
2014.12.18 |
申请人 |
DOWA ELECTRONICS MATERIALS CO LTD |
发明人 |
SHOJI SHINYA;ISHII MASATO;UMETSU KAZUYUKI;SUGIURA JUNJI |
分类号 |
H01L21/304;B28D5/00 |
主分类号 |
H01L21/304 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|