发明名称 WAFER GROUP, AND DEVICE AND METHOD FOR MANUFACTURING WAFER
摘要 PROBLEM TO BE SOLVED: To provide a wafer group that can easily form products with uniformity when there is variations in compositions of the wafers, and a technique of highly precisely and certainly forming an OF (orientation flat) by removing uncertainties in forming the OF.SOLUTION: There are provided a wafer group formed of 70 or more wafers, which each have an OF with an OF orientation precision within a range of ±0.010° and are obtained from the same ingot, and a technique relating to the wafer group.SELECTED DRAWING: Figure 3
申请公布号 JP2016119335(A) 申请公布日期 2016.06.30
申请号 JP20140256502 申请日期 2014.12.18
申请人 DOWA ELECTRONICS MATERIALS CO LTD 发明人 SHOJI SHINYA;ISHII MASATO;UMETSU KAZUYUKI;SUGIURA JUNJI
分类号 H01L21/304;B28D5/00 主分类号 H01L21/304
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