| 摘要 |
PROBLEM TO BE SOLVED: To provide a circuit board capable of suppressing separation between a metal block and an insulation resin layer, and to provide a method of manufacturing the same.SOLUTION: In a circuit board 10, because both front and rear faces (a first principal surface 17F and a second principal surface 17B) covered with a first insulation resin layer 21, 21, of a metal block 17 accommodated in a cavity 16 of a core substrate 11 are rough surfaces, separation between the metal block 17 and the first insulation resin layer 21, 21 can be suppressed, and thereby, fixing of the metal block 17 in the circuit board 10 is stabilized.SELECTED DRAWING: Figure 4 |
