发明名称 Thin film transistor and method for manufacturing the same, and display device
摘要 A method for manufacturing a thin film transistor according to the present disclosure may include the following steps of: performing a two-step etching on an active layer such that part of the active layer is consistent with a source-drain electrode layer, and etching the active layer within a photoresist-removed-area to form an active layer tail; ashing a photoresist layer such that a contour of the photoresist layer is consistent with that of the source-drain electrode layer; further etching the source-drain electrode layer to form a source-drain electrode layer pattern including a source electrode and a drain electrode, and etching off a doped semiconductor layer between the source electrode and the drain electrode, and meanwhile etching off the active layer tail.
申请公布号 US9171732(B1) 申请公布日期 2015.10.27
申请号 US201414514968 申请日期 2014.10.15
申请人 BOE TECHNOLOGY GROUP CO., LTD.;BEIJING BOE OPTOELECTRONICS TECHNOLOGY CO., LTD. 发明人 Li Tiansheng;Xie Zhenyu
分类号 H01L21/336;H01L21/306;H01L27/12;H01L29/66 主分类号 H01L21/336
代理机构 Harness, Dickey & Pierce, P.L.C. 代理人 Harness, Dickey & Pierce, P.L.C.
主权项 1. A method for manufacturing a thin film transistor, comprising the following steps of: S1. forming an active layer and a source-drain electrode layer; S2. coating a photoresist layer on the source-drain electrode layer, exposing and developing a substrate coated with the photoresist layer to form a photoresist pattern comprising a photoresist-remained area, a photoresist-half-remained area and a photoresist-removed area; S3. etching by using the photoresist pattern as a mask, and etching off the source-drain electrode layer within the photoresist-removed area; S4. performing a two-step etching on the active layer, wherein the two-step etching comprises a first etching, which makes a contour of the active layer below the source-drain electrode layer covered by the photoresist layer consistent with that of the source-drain electrode layer; and a second etching, which etches the active layer within the photoresist-removed area and ensures a longitudinal etching contour of the active layer, and forms an active layer tail; and S5. ashing the photoresist layer such that the contour of the photoresist layer becomes consistent with that of the source-drain electrode layer; etching the source-drain electrode layer by using the photoresist pattern as a mask to form a source-drain electrode pattern comprising a source electrode and a drain electrode, and etching off a doped semiconductor layer between the source electrode and the drain electrode, and meanwhile etching off the active layer tail.
地址 Beijing CN