发明名称 NESTED THROUGH GLASS VIA TRANSFORMER
摘要 A 3D nested transformer includes a substrate having a set of through substrate vias daisy chained together with a set of traces. At least some of the through substrate vias have first and second conductive regions. The set of traces also includes a first set of traces coupling together at least some of the first conductive regions of the through substrate vias, and a second set of traces coupling together at least some of the second conductive regions of the through substrate vias.
申请公布号 US2016276101(A1) 申请公布日期 2016.09.22
申请号 US201615167782 申请日期 2016.05.27
申请人 QUALCOMM Incorporated 发明人 KIM Daeik Daniel;KIM Jonghae;ZUO Chengjie;VELEZ Mario Francisco;YUN Changhan Hobie
分类号 H01F41/04 主分类号 H01F41/04
代理机构 代理人
主权项 1. A method of fabricating a 3D nested transformer, comprising: forming a plurality of through substrate vias in a substrate; and daisy chaining the through substrate vias together with a plurality of traces, at least some of the plurality of through substrate vias having first and second conductive regions, in which the first conductive regions comprise inner cores of the plurality of through substrate vias and the second conductive regions comprise outer shells of the plurality of through substrate vias, the daisy chaining performed by: coupling a first set of traces to at least some of the first conductive regions of the plurality of through substrate vias, andcoupling a second set of traces to at least some of the second conductive regions of the plurality of through substrate vias.
地址 San Diego CA US