发明名称 HIGH CURRENT, LOW EQUIVALENT SERIES RESISTANCE PRINTED CIRCUIT BOARD COIL FOR POWER TRANSFER APPLICATION
摘要 An apparatus for a multilayer printed circuit board (PCB) coil, comprising: a first coil layer of a PCB; a plurality of vias coupled to and distributed to cover substantially the surface of the first coil layer within the PCB; and a second coil layer of the PCB and coupled to the vias to cover substantially the surface of the second coil layer, wherein the vias are positioned between the first coil layer and the second coil layer and enable substantially high current and low equivalent series resistance (ESR) for the multilayer PCB coil.
申请公布号 US2016276095(A1) 申请公布日期 2016.09.22
申请号 US201615168190 申请日期 2016.05.30
申请人 Futurewei Technologies, Inc. 发明人 ZABACO Jorge
分类号 H01F27/28;H02J7/02;H04B5/00;H01F38/14 主分类号 H01F27/28
代理机构 代理人
主权项 1. An apparatus for charging, comprising: a layered structure of electric conductors on a printed circuit board (PCB), the layered structure positioned around a center core, the electric conductors winding around the center core for inductive coupling, wherein the layered structure comprises: a first layer of the electric conductors around the center core, the first layer of the electric conductors form an electrically conductive trace comprising a plurality of loops around the center core; a second layer of the electric conductors around the center core substantially overlaid with the first layer of the electric conductors on the PCB; and a plurality of vias disposed between the first layer and the second layer, the vias conductively coupling the first layer of the electric conductors and the second layer of the electric conductors, wherein the plurality of the vias include a first via and a second via distributed separately along a length of the trace to electrically connect the trace of the first layer and the second layer of the conductors.
地址 Plano TX US