发明名称 INDUCTORS FOR CIRCUIT BOARD THROUGH HOLE STRUCTURES
摘要 Systems, apparatuses, and methods may include a circuit board having a plated through hole with a via portion and a stub portion and a self-coupled inductor electrically coupled to the via portion of the plated through hole. The self-coupled inductor may include a first inductor mutually coupled to a second inductor in series to reduce a capacitive effect of the stub portion of the plated through hole.
申请公布号 US2016276091(A1) 申请公布日期 2016.09.22
申请号 US201514664827 申请日期 2015.03.21
申请人 INTEL CORPORATION 发明人 Zhang Zhichao;Ouyang Gong;Xiao Kai;Aygun Kemal;Lee Beom-Taek
分类号 H01F27/28;H05K3/30;H05K1/11;H01F41/04;H05K1/18 主分类号 H01F27/28
代理机构 代理人
主权项 1. A system comprising: a first circuit board including a first device selected from a processor, a controller, a memory, a switch, a complex programmable logic device, a programmable logic array, or an integrated circuit; a first plated through hole having a first via portion and a first stub portion; a first self-coupled inductor electrically coupled to the first via portion, the first self-coupled inductor including a first inductor in series with a second inductor, the first and second inductors being mutually coupled to reduce a capacitive effect of the first stub portion; and a second device selected from a processor, a controller, a memory, a switch, a complex programmable logic device, a programmable logic array, or an integrated circuit, the second device electrically coupled to the first circuit board.
地址 Santa Clara CA US