发明名称 |
MEMORY MODULE AND MEMORY SYSTEM |
摘要 |
A memory module is provided which includes a printed circuit board; first semiconductor packages provided on one surface of the printed circuit board; and second semiconductor packages provided on the other surface of the printed circuit board, the first semiconductor packages and the second semiconductor packages having semiconductor dies that form ranks. A number of the ranks formed by the first semiconductor packages being different from a number of the ranks formed by the second semiconductor packages. Semiconductor packages forming a same one of the ranks receive a chip selection signal in common and semiconductor packages forming other ranks receive a different chip selection signal. |
申请公布号 |
US2016275995(A1) |
申请公布日期 |
2016.09.22 |
申请号 |
US201615168961 |
申请日期 |
2016.05.31 |
申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
SONG Won-Hyung;KIM Kyoungsun;KIM Yong-Jin;LEE Jaejun;KANG Sangseok;LEE Jungjoon |
分类号 |
G11C5/04;G06F13/40;G06F13/42;G06F13/10 |
主分类号 |
G11C5/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
Suwon-si KR |