| 摘要 |
A method for producing a light emitting device includes a first bonding step including disposing a first bonding member a mounting substrate, placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the mounting substrate, and hardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element; and a second bonding step including disposing a second bonding member on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, and hardening the second bonding member. |
| 主权项 |
1. A method for producing a light emitting device, the method comprising:
a first bonding step comprising:
disposing a first bonding member in a liquid or paste form on an upper face of a mounting substrate,placing a light emitting element on the mounting substrate such that the first bonding member is located between a mounting face of the light emitting element and the upper face of the mounting substrate, wherein the light emitting element includes an electrode at an upper face of the light emitting element, andhardening the first bonding member thereby bonding the light emitting element and the mounting substrate such that, in a plan view, an entirety of the first bonding member is contained within an area of the mounting face of the light emitting element, and a second bonding step comprising:
disposing a second bonding member in a liquid or paste form on the upper face of the mounting substrate such that, in a plan view, the second bonding member is located at at least a portion of an outer edge of the mounting face of the light emitting element, andhardening the second bonding member. |
