INTEGRATED CORE MICROELECTRONIC PACKAGE

摘要

A MICROELECTRONIC PACKAGE INLCUDING A MICROELECTRONIC DIE DISPOSED WITHIN AN OPENING IN A MICROELECTRONIC PACKAGING CORE,WHEREIN AN ENCAPSULATION MATERIAL IS DISPOSED WITHIN PORTIONS OF THE OPENING NOT OCCUPIED BY THE MICROELECTRONIC DIE.BUILD-UP LAYERS OF DIELECTRIC MATERIALS AND CONDUCTIVE TRACES ARE THEN FABRICATED ON THE MICROELECTRONIC DIE,THE ENCAPSULANT MATERIAL,AND THE MICROELECTRONIC PACKAGE CORE TO FROM THE MICROELECTRONIC PACKAGE.