发明名称 Inertial bonding method of forming a sputtering target assembly and assembly made therefrom
摘要 A method of forming a sputtering target assembly and the sputtering target assembly made therefrom are described. The method can include bonding a sputtering target to a backing plate with the use of solder, braze metal, or alloys thereof, and reflowing the solder or braze metal after bonding the sputtering target to the backing plate.
申请公布号 US2007084719(A1) 申请公布日期 2007.04.19
申请号 US20060527766 申请日期 2006.09.26
申请人 WICKERSHAM CHARLES E JR;HAAG JASON 发明人 WICKERSHAM CHARLES E.JR.;HAAG JASON
分类号 C23C14/00 主分类号 C23C14/00
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