发明名称 |
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of reducing effect of plasma damage on a semiconductor element in manufacturing. SOLUTION: The manufacturing method includes a process for forming the semiconductor element on a semiconductor substrate, and a process for forming a film on the semiconductor element by CVD treatment using microwave plasma in which a microwave is a plasma source, an electron temperature of plasma is lower than 1.5 eV and an electron density of the plasma is higher than 1×10<SP>11</SP>cm<SP>-3</SP>in the vicinity of a surface of the semiconductor substrate. COPYRIGHT: (C)2009,JPO&INPIT |
申请公布号 |
JP2009059850(A) |
申请公布日期 |
2009.03.19 |
申请号 |
JP20070225224 |
申请日期 |
2007.08.31 |
申请人 |
TOHOKU UNIV;TOKYO ELECTRON LTD |
发明人 |
TERAMOTO AKINOBU;OMI TADAHIRO;UEDA HIROICHI;NOZAWA TOSHIHISA;MATSUOKA TAKAAKI |
分类号 |
H01L21/31;H01L21/28;H01L21/283;H01L21/3065;H01L21/3213;H01L21/768;H01L23/522;H01L29/78 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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