发明名称 MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide a manufacturing method of a semiconductor device capable of reducing effect of plasma damage on a semiconductor element in manufacturing. SOLUTION: The manufacturing method includes a process for forming the semiconductor element on a semiconductor substrate, and a process for forming a film on the semiconductor element by CVD treatment using microwave plasma in which a microwave is a plasma source, an electron temperature of plasma is lower than 1.5 eV and an electron density of the plasma is higher than 1&times;10<SP>11</SP>cm<SP>-3</SP>in the vicinity of a surface of the semiconductor substrate. COPYRIGHT: (C)2009,JPO&amp;INPIT
申请公布号 JP2009059850(A) 申请公布日期 2009.03.19
申请号 JP20070225224 申请日期 2007.08.31
申请人 TOHOKU UNIV;TOKYO ELECTRON LTD 发明人 TERAMOTO AKINOBU;OMI TADAHIRO;UEDA HIROICHI;NOZAWA TOSHIHISA;MATSUOKA TAKAAKI
分类号 H01L21/31;H01L21/28;H01L21/283;H01L21/3065;H01L21/3213;H01L21/768;H01L23/522;H01L29/78 主分类号 H01L21/31
代理机构 代理人
主权项
地址