发明名称 半導体集積回路、電子機器、固体撮像装置、撮像装置
摘要 A semiconductor integrated circuit includes a first semiconductor substrate in which a part of an analog circuit is formed between the analog circuit and a digital circuit which subjects an analog output signal output from the analog circuit to digital conversion; a second semiconductor substrate in which the remaining part of the analog circuit and the digital circuit are formed; and a substrate connection portion which connects the first and second semiconductor substrates to each other. The substrate connection portion transmits an analog signal which is generated by a part of the analog circuit of the first semiconductor substrate to the second semiconductor substrate.
申请公布号 JP5810493(B2) 申请公布日期 2015.11.11
申请号 JP20100197730 申请日期 2010.09.03
申请人 ソニー株式会社 发明人 工藤 義治
分类号 H01L27/146;H04N5/374;H04N5/378 主分类号 H01L27/146
代理机构 代理人
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