Package-on-Package Structure Including a Thermal Isolation Material and Method of Forming the Same

摘要

A semiconductor device includes a first package component and a second package component. The first package component has a first die formed on a first substrate. A second package component has a second die formed on a second substrate. A thermal isolation material is attached on the first die, wherein the thermal isolation material thermally insulates the second die from the first die, and the thermal isolation material has a thermal conductivity of from about 0.024 W/mK to about 0.2 W/mK. A first set of conductive elements couples the first package component to the second package component.

主权项

1. A method comprising:
bonding a first die to a first substrate to form a first package component; disposing a thermal isolation material to form a seal ring on a top surface of the first die, wherein the seal ring has a plurality of sides, each adjacent to an edge of the first die; and bonding a second package component to the first package component, wherein a bottom surface of the second package component contacts the seal ring, and the first die, the second package component, and the seal ring encloses air or vacuum therein.