SYSTEM, APPARATUS, AND METHOD FOR EMBEDDING A 3D COMPONENT WITH AN INTERCONNECT STRUCTURE

摘要

A package may include a die proximate to a structure having a substrate with interconnects and a first component coupled to the interconnects. The die may be face up or face down. The package may include a first redistribution layer coupling the die to the interconnects of the structure and a mold compound covering the die and maybe the structure.

主权项

1. A package comprising:
a die with an active side; a structure comprising a substrate, interconnects, and a first component coupled to the interconnects, the substrate oriented at an angle greater than 10 degrees relative to a face of the die; a mold compound configured to at least partially cover the die; and a redistribution layer coupled to the active side of the die, the redistribution layer configured to couple the die to the interconnects.