PROCESS FOR PRODUCING A MICROFLUIDIC CIRCUIT WITHIN A THREE-DIMENSIONAL INTEGRATED STRUCTURE, AND CORRESPONDING STRUCTURE

摘要

A three-dimensional integrated structure includes a first and a second element each having an interconnection part formed by metallization levels encased in an insulating region. The first and second elements are attached to one another by the respective interconnection parts. The first element includes an electrical connection via passing through a substrate. A thermal cooling system includes at least one cavity having a first part located in the insulating region of the interconnection part of the first element and a second part located in the insulating region of the interconnection part of the second element and at least one through channel extending from a rear face of the first element to open into the at least one cavity.

主权项

1. A process, comprising:
producing a three-dimensional integrated structure comprising: forming a first element and a second element, each first and second element having an interconnection part comprising metallization levels encased in an insulating region, producing in the first element at least one via passing through a substrate of the first element; producing in the insulating region of each interconnection part a metal block; producing in the first element at least one additional via passing through the substrate of the first element and contacting the metal block in the insulating region of the first element; firmly attaching the first and second elements to one another by attaching their respective interconnection parts and respective metal blocks to each other, and then removing metal contained in said at least one additional via and in the metal blocks by etching from a rear face of the substrate of the first element so as to form a thermal cooling system comprising a cavity in place of the blocks and at least one through passage in place of said at least one additional through via.