| 摘要 |
PROBLEM TO BE SOLVED: To provide a new technique capable of preparing a mounting part having a low resistance in a short time even on a substrate material having a low heat resistance and a product manufactured by using the technique, and a material for baking metallic particles for mutually fusing the metallic particles used for the technique in a direct circuit drawing method using the metallic particles. SOLUTION: There is provided a method for mutually fusing the metallic particles selectively heating a metallic particle by surface-coating or circuit-patterning the metallic particles 2 excellent in high-frequency electromagnetic-wave absorptivity or the metallic particles 2 mixed with a sintering assistant excellent in high-frequency electromagnetic-wave absorptivity, on various substrates 1, and conducting a high-frequency electromagnetic-wave irradiation. There are provided an electronic mounting part such as a conductive material, a conductive path, an antenna, a bump, a pad, a via or the like and a solid wiring board and a thermal conductive path, a catalytic electrode and a solid wiring formed by using the method. COPYRIGHT: (C)2007,JPO&INPIT
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