| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor integrated circuit which controls directly a bonding option pad to perform surely the sensing of faults such as a bonding faultiness. SOLUTION: With respect to the semiconductor integrated circuit, there are provided a p-channel transistor 2 for connecting a bonding option pad 1 via a resistor 2a with a power supply VDD in the circuit and an n-channel transistor 3 for connecting the bonding option pad 1 via a resistor 3a with VSS (GND) in the circuit. With respect to an inspecting method, in the state wherein the bonding option pad 1 is connected with a VDD or VSS terminal of a lead frame, the p-channel transistor 2 and the n-channel transistor 3 are brought alternately into ON-state or OFF-state (the bonding option pad is so controlled directly) so as to measure the currents flowing in those cases and to decide the fault of the pad. COPYRIGHT: (C)2007,JPO&INPIT
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