发明名称 PROBE CARD ASSEMBLY SUBSTRATE AND PROBE CARD ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a probe card assembly substrate capable of shortening a delivery period and reducing a cost by sharing an insulating base. SOLUTION: The probe card assembly substrate includes an insulation layer having a first surface and a second surface, a plurality of contact terminals formed on the first surface, a plurality of electrode groups 6 for power supply electrically connected with the plurality of contact terminals and formed in a central region C located at the center of the second surface, and a plurality of signal electrode groups 10 electrically connected with the contact terminals and formed in a peripheral region P located around the central region C. An area of each of the signal electrode groups 10 is larger than that of each of the electrode groups 9. COPYRIGHT: (C)2008,JPO&INPIT
申请公布号 JP2008209237(A) 申请公布日期 2008.09.11
申请号 JP20070046115 申请日期 2007.02.26
申请人 KYOCERA CORP 发明人 HIWAKI YOICHI
分类号 G01R1/073;G01R31/26;H01L21/66 主分类号 G01R1/073
代理机构 代理人
主权项
地址