发明名称 |
POLYAMIDE RESIN COMPOSITION FOR MOLDING IN CONTACT WITH HIGH-PRESSURE HYDROGEN, AND MOLDING PREPARED THEREWITH |
摘要 |
PROBLEM TO BE SOLVED: To provide a polyamide resin composition that makes it possible to obtain a molding that prevents the occurrence of defective points even with repeated filling and discharge of high-pressure hydrogen.SOLUTION: A polyamide resin composition for molding in contact with high-pressure hydrogen comprises a polyamide resin (A) and an organic nucleator (B) with a weight average molecular weight of 5000 or less.SELECTED DRAWING: None |
申请公布号 |
JP2016104846(A) |
申请公布日期 |
2016.06.09 |
申请号 |
JP20150079981 |
申请日期 |
2015.04.09 |
申请人 |
TORAY IND INC |
发明人 |
OCHIAI SHINICHIRO;SATO DAISUKE;KOBAYASHI SADAYUKI |
分类号 |
C08L77/00;C08K5/00;C08L23/26 |
主分类号 |
C08L77/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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