发明名称 POLYAMIDE RESIN COMPOSITION FOR MOLDING IN CONTACT WITH HIGH-PRESSURE HYDROGEN, AND MOLDING PREPARED THEREWITH
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition that makes it possible to obtain a molding that prevents the occurrence of defective points even with repeated filling and discharge of high-pressure hydrogen.SOLUTION: A polyamide resin composition for molding in contact with high-pressure hydrogen comprises a polyamide resin (A) and an organic nucleator (B) with a weight average molecular weight of 5000 or less.SELECTED DRAWING: None
申请公布号 JP2016104846(A) 申请公布日期 2016.06.09
申请号 JP20150079981 申请日期 2015.04.09
申请人 TORAY IND INC 发明人 OCHIAI SHINICHIRO;SATO DAISUKE;KOBAYASHI SADAYUKI
分类号 C08L77/00;C08K5/00;C08L23/26 主分类号 C08L77/00
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