| 发明名称 |
Electronic Component and Overmolding Process |
| 摘要 |
Electronic components and overmolding processes are disclosed. The electronic component, such as, an antenna, includes a substrate, an overmolding bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material, and a conductive ink positioned on the substrate between the substrate and the overmolding. The conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. The overmolding process includes providing a substrate, applying a conductive ink onto the substrate, and bonding an overmolding to at least a portion of the substrate, the overmolding being an arrangement of a polymeric material. The conductive ink is devoid or substantially devoid of delamination or fracture through the bonding of the overmolding to the substrate. |
| 申请公布号 |
US2016183381(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414581679 |
申请日期 |
2014.12.23 |
| 申请人 |
Tyco Electronics Corporation |
发明人 |
Bishop Bruce Foster;Brennian, JR. Ronald W.;Oar Michael A.;Radzilowski Leonard Henry |
| 分类号 |
H05K3/28;H05K1/02;H05K3/10;H05K1/09 |
主分类号 |
H05K3/28 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic component, comprising:
a substrate; an overmolding bonded to at least a portion of the substrate, the overmolding being a non-planar arrangement of a polymeric material; and a conductive ink positioned on the substrate between the substrate and the overmolding; wherein the conductive ink is devoid or substantially devoid of delamination or fracture from the bonding of the overmolding to the substrate. |
| 地址 |
Berwyn PA US |
