| 发明名称 |
DIELECTRIC FILMLESS ELECTRONIC MODULE AND METHOD FOR MANUFACTURING SAME |
| 摘要 |
The invention relates to an electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an insulating layer that is electrically connected to the metal layer via a first surface, a second metal layer connected to the insulating layer on the opposite surface thereof, a chip location or an electronic chip electrically connected to the at least one contact pad through openings in the insulating layer, characterized in that the insulating layer is an adhesive. |
| 申请公布号 |
US2016183377(A1) |
申请公布日期 |
2016.06.23 |
| 申请号 |
US201414903770 |
申请日期 |
2014.06.19 |
| 申请人 |
GEMALTO SA |
发明人 |
OTTOBON Stéphane;DOSSETTO Lucile;DEGEILH Line |
| 分类号 |
H05K1/18;H05K3/40;H05K3/32;H05K1/11 |
主分类号 |
H05K1/18 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. An electronic module comprising a first metal layer including at least one contact pad or a conductive pad for connection or interconnection, an electrically insulating layer that is connected to the metal layer via a first surface and a second metal layer connected to the insulating layer on the opposite surface thereof, location for a chip or electronic chip electrically connected to said at least one contact pad, through openings in the insulating layer,
wherein the insulating layer is an adhesive. |
| 地址 |
Meudon FR |
