发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDED BODY
摘要 PROBLEM TO BE SOLVED: To provide a polyamide resin composition inhibiting the used amount of an iodine compound, using a bromine compound as alternative, excellent in heat aging resistance, having suppressed metal corrosion property and copper deposition property, used as a raw material for components for automobile engine room or the like and capable of being manufactured more economically than conventional ones.SOLUTION: There is provided a polyamide resin composition containing (A) a polyamide resin, (B) a copper compound such as halogenated copper compound, (C) bromide of an alkali metal and/or an alkali earth metal, (D) an aromatic secondary amine compound and a secondary amine compound such as hindered amine type photostabilizer, optionally (E) one or more kind of aliphatic acid compound selected from aliphatic acid ester, aliphatic acid amide or aliphatic acid metal salt and optionally (F) an inorganic filler.SELECTED DRAWING: None
申请公布号 JP2016117890(A) 申请公布日期 2016.06.30
申请号 JP20150245579 申请日期 2015.12.16
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SAKUMA TERUAKI;TERADA KAZUNORI
分类号 C08L77/00;C08K3/00;C08K3/16;C08K5/098;C08K5/10;C08K5/18;C08K5/20;C08K5/3435 主分类号 C08L77/00
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