| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat radiation structure which effectively radiates heat generated by an electronic component and is easily manufactured.SOLUTION: A heat radiation structure includes at least one heating element 1 to 4; at least one base body 10 having a first major surface 10A and a second major surface 10B positioned at the opposite side of the first major surface 10A and in which the heating element is mounted on the first major surface 10A; and at least one first fin 20 connected to the second major surface 10B. A material forming the base body 10 contains a metal. A material mainly forming the first fin 20 is a resin. The second major surface 10B of the base body 10 includes a first irregularity part 30 in which irregularities are formed. An area of the second major surface 10B, which is connected to the first fin 20, includes the first irregularity part 30.SELECTED DRAWING: Figure 2 |
