摘要 |
PROBLEM TO BE SOLVED: To provide component mounting method and device that can suppress occurrence of adsorption error caused by unstable component supply, thereby suppressing reduction of productivity.SOLUTION: Component mounting method and device in which a component fed to a component pickup position by a tape feeder is adsorbed and held by an adsorption nozzle after a predetermined delay time elapses from a pitch feeding timing, calculate the displacement amount between a first tape position achieved by a first imaging step for imaging the component pickup position at a timing when the delay time elapses, and a second tape position achieved based on an imaging result of a second imaging step for performing imaging again after the first imaging step, and extend the delay time when the calculated displacement amount is over a permission range.SELECTED DRAWING: Figure 7 |