Sub-Pixel and Sub-Resolution Localization of Defects on Patterned Wafers

摘要

Methods and systems for determining if a defect detected on a specimen is a DOI (Defect of Interest) or a nuisance are provided. One system includes computer subsystem(s) configured for aligning output of an inspection subsystem for an area on a specimen to simulated output of the inspection subsystem for the area on the specimen and detecting a defect in the output for the area on the specimen. The computer subsystem(s) are also configured for determining a location of the defect in the output with respect to patterned features in the simulated output based on results of the detecting and aligning, determining a distance between the determined location of the defect and a known location of interest on the specimen, and determining if the defect is a DOI or a nuisance based on the determined distance.

主权项

1. A system configured to determine if a defect detected on a specimen is a defect of interest or a nuisance, comprising:
an inspection subsystem comprising at least an energy source and a detector, wherein the energy source is configured to generate energy that is directed to a specimen, and wherein the detector is configured to detect energy from the specimen and to generate output responsive to the detected energy; and one or more computer subsystems configured for:
aligning the output of the inspection subsystem for an area on the specimen to simulated output of the inspection subsystem for the area on the specimen;detecting a defect in the output for the area on the specimen;determining a location of the defect in the output with respect to patterned features in the simulated output based on results of said detecting and said aligning;determining a distance between the determined location of feet and a known location of interest on the specimen; anddetermining if the defect is a defect of interest or a nuisance based on the determined distance.