| 摘要 |
PROBLEM TO BE SOLVED: To provide powder capable of suppressing scattering at the molding time, or generation of a molding defect.SOLUTION: In this powder containing silica and sodium, the sodium content rate is ≥0.005 and ≤3 mass%, the BET specific surface area is ≥10 and ≤400 m/g, the compression degree is ≤31%, and the thermal conductivity at 30°C is ≤0.05 W/m-K. |
