PRINTED CIRCUIT BOARD, MANUFACTURING METHOD OF PRINTED CIRCUIT BOARD, AND ELECTRONIC APPLIANCE

摘要

PROBLEM TO BE SOLVED: To avoid a bonding defect of a solder junction of a circuit board mounted with a large-sized semiconductor package such as a BGA and an LGA, and to easily perform reworking by reducing an influence of external stress on the solder junction.

SOLUTION: A printed circuit board includes: a printed wiring board 11; a semiconductor package 15 mounted on the printed wiring board 11; a plurality of reinforcement pads 16 that are provided on the printed wiring board 11 at a plurality of positions along peripheral edges of a mounting surface portion where the semiconductor package 15 is mounted, each of the reinforcement pads having a solder coated film 17 formed thereon; and a plurality of reinforcing adhesive parts 18 that fix the reinforcement pads 16 and semiconductor package 15 at a plurality of positions to reinforce solder junctions 14 of the semiconductor package 15 locally at a plurality of positions.

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