发明名称 |
銅/セラミックス接合体、及び、パワーモジュール用基板 |
摘要 |
PROBLEM TO BE SOLVED: To provide: a copper/ceramics connected body in which a copper member made of copper or copper alloy and a ceramics member made of nitride ceramics are surely connected to each other; and a power module substrate made of the copper/ceramics connected body.SOLUTION: A copper/ceramics connected body has a copper member 22 made of copper or copper alloy and a ceramics member 11 made of nitride ceramics that are connected to each other. An active element oxide layer 30 containing an active element and oxygen is formed on a connection interface between the copper member 22 and the ceramics member 11. A thickness t of the active element oxide layer 30 is in a range of not less than 5 nm nor more than 200 nm. |
申请公布号 |
JP5828352(B2) |
申请公布日期 |
2015.12.02 |
申请号 |
JP20140136567 |
申请日期 |
2014.07.02 |
申请人 |
三菱マテリアル株式会社 |
发明人 |
寺▲崎▼ 伸幸;長友 義幸 |
分类号 |
C04B37/02;B23K1/19;H01L23/12;H01L23/13;H01L23/36;H01L25/07;H01L25/18;H05K1/02 |
主分类号 |
C04B37/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|