发明名称 銅/セラミックス接合体、及び、パワーモジュール用基板
摘要 PROBLEM TO BE SOLVED: To provide: a copper/ceramics connected body in which a copper member made of copper or copper alloy and a ceramics member made of nitride ceramics are surely connected to each other; and a power module substrate made of the copper/ceramics connected body.SOLUTION: A copper/ceramics connected body has a copper member 22 made of copper or copper alloy and a ceramics member 11 made of nitride ceramics that are connected to each other. An active element oxide layer 30 containing an active element and oxygen is formed on a connection interface between the copper member 22 and the ceramics member 11. A thickness t of the active element oxide layer 30 is in a range of not less than 5 nm nor more than 200 nm.
申请公布号 JP5828352(B2) 申请公布日期 2015.12.02
申请号 JP20140136567 申请日期 2014.07.02
申请人 三菱マテリアル株式会社 发明人 寺▲崎▼ 伸幸;長友 義幸
分类号 C04B37/02;B23K1/19;H01L23/12;H01L23/13;H01L23/36;H01L25/07;H01L25/18;H05K1/02 主分类号 C04B37/02
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