| 发明名称 |
PACKAGE WITH MULTIPLE PLANE I/O STRUCTURE |
| 摘要 |
A embodiment package includes a three dimensional integrated circuit (3D IC) with first input/output pads on a first side and second input/output pads on a second side, a first fan out structure electrically coupled to the first input/output pads on the first side of the three dimensional integrated circuit, and a second fan out structure electrically coupled to the second input/output pads on the second side of the three dimensional integrated circuit. |
| 申请公布号 |
US2016197060(A1) |
申请公布日期 |
2016.07.07 |
| 申请号 |
US201615071920 |
申请日期 |
2016.03.16 |
| 申请人 |
Taiwan Semiconductor Manufacturing Company, Ltd. |
发明人 |
Yu Hung-Chang;Lin Kai-Chun;Chih Yue-Der |
| 分类号 |
H01L25/065;H01L23/498;H01L23/00;H01L25/00;H01L21/56 |
主分类号 |
H01L25/065 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A method of forming a package, the method comprising:
bonding one or more dies forming a chip stack, the chip stack having a first outermost die and a second outermost die opposite the first outermost die; bonding the first outermost die to a first side of a first substrate, a second side of the first substrate having a first set of input/output pads; and bonding the second outermost die to a first side of a second substrate, a second side of the second substrate having a second set of input/output pads. |
| 地址 |
Hsin-Chu TW |
