发明名称 |
METHOD OF FABRICATING SEMICONDUCTOR PACKAGE |
摘要 |
A method of fabricating a semiconductor package is provided, including: disposing a plurality of semiconductor elements on a carrier through an adhesive layer in a manner that a portion of the carrier is exposed from the adhesive layer; forming an encapsulant to encapsulate the semiconductor elements; removing the adhesive layer and the carrier to expose the semiconductor elements; and forming a build-up structure on the semiconductor elements. Since the adhesive layer is divided into a plurality of separated portions that will not affect each other due to expansion or contraction when temperature changes, the present invention prevents positional deviations of the semiconductor elements during a molding process, thereby increasing the alignment accuracy. |
申请公布号 |
US2016196990(A1) |
申请公布日期 |
2016.07.07 |
申请号 |
US201615074110 |
申请日期 |
2016.03.18 |
申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Chang Chiang-Cheng;Lee Meng-Tsung;Huang Jung-Pang;Chiu Shih-Kuang;Huang Fu-Tang |
分类号 |
H01L21/56;H01L21/768;H01L21/683 |
主分类号 |
H01L21/56 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
Taichung TW |