| 摘要 |
Very fine closed form structures can be scribed via filamentation in the transparent substrate very quickly, the modified zone can be etched via dry or wet chemical etching to release the closed form. A metal layer engages the transparent substrate and is covered with photoresist. A portion of the photoresist and a portion of the metal are removed simultaneously with the creation of a filament through the transparent substrate. The photoresist protects the portion of the metal layer that is not removed. The desired closed form can be released by weakening the cut region using dry or wet chemical etching to remove the desired part. |
