MANUFACTURING METHOD FOR JUNCTION, MANUFACTURING METHOD FOR SUBSTRATE FOR POWER MODULE WITH HEAT SINK, AND MANUFACTURING METHOD FOR HEAT SINK

摘要

Provided is a manufacturing method for a junction formed by joining a copper member (13B) comprising copper or a copper alloy, and an aluminum member (31) comprising an aluminum alloy having an Si concentration in a range of not lower than 1 mass% and not higher than 25 mass%. The manufacturing method for the junction is characterized by: setting, in the aluminum member before joining, a circle equivalent diameter D90 of an Si phase in a junction surface with the copper member to be in a range of not smaller than 1 μm and not larger than 8 μm; and joining by solid phase diffusion the aluminum member and the copper member.