| 摘要 |
PROBLEM TO BE SOLVED: To provide a bonding device which can flexibly control a capillary tip when a ball formed at a tip of a wire is bonded to an electrode of a semiconductor chip along with scrub oscillation.SOLUTION: A bonding device comprises an oscillation drive part 7 which includes: a plurality of piezoelectric elements 10 each of which has one end fixed to a tip of a bonding arm 3 and expands and contracts along a direction of an axis of the bonding arm 3; a plurality of capillary holding parts 15 each of which is fixed to each another end of the plurality of piezoelectric elements 10 and contacts a peripheral surface of the capillary 20 on the side of a base end; and a pressure holding part 21 in which at least one end side is fixed to the bonding arm 3 and the other side contacts the base end side peripheral surface of the capillary 20 on the side opposite to the capillary holding parts 15 to push the capillary 20 to the plurality of capillary holding parts 15 to sandwich the capillary 20. In the plurality of piezoelectric elements, a functional operation of an amplitude, a phase, a frequency or a waveform is performed on a waveform of a drive voltage to each piezoelectric element. |
