发明名称 電子部品用収容部材
摘要 An accommodation space formation member forms an accommodation space and a communication hole. The accommodation space accommodates an electronic component. The communication hole communicates the accommodation space with an outside of the accommodation space formation member. A ventilation member is equipped to the communication hole or an opening of the communication hole on a side of the accommodation space. The ventilation member is configured to permit flow of vapor between the accommodation space and the outside and to restrict flow of liquid between the accommodation space and the outside. The accommodation space formation member has an outer wall having a first groove portion, which forms a first groove. The first groove communicates with an opening of the communication hole on the outside.
申请公布号 JP5831471(B2) 申请公布日期 2015.12.09
申请号 JP20130029000 申请日期 2013.02.18
申请人 株式会社デンソー 发明人 渡辺 和幸
分类号 H05K5/06;B60R16/02;F01L1/34 主分类号 H05K5/06
代理机构 代理人
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