发明名称 |
LIGHT EMITTING DIODE PACKAGE AND METHOD OF FABRICATING THE SAME |
摘要 |
A light-emitting diode package and a manufacturing method thereof are provided to provide the illumination that the directivity angle is small to the application area in which the locality illumination is required by forming the lens having the lens surface of the conical shape. A light emitting diode package comprises a housing(10) having a cavity(16); an LED chip(20) which is built in the cavity; a lens(30) which is protruded to the upper housing part on the LED chip and forms the conical lens side(30s). A side wall(14) of cavity includes a reflector with slope. The edge groove(18) restricts the edge region of lens around the housing. The lens fills the cavity and the edge groove. The housing includes a gap at the lower part. |
申请公布号 |
KR20090021694(A) |
申请公布日期 |
2009.03.04 |
申请号 |
KR20070086426 |
申请日期 |
2007.08.28 |
申请人 |
ALTI-ELECTRONICS CO., LTD. |
发明人 |
CHOI, HAW KYUNG |
分类号 |
H01L33/58 |
主分类号 |
H01L33/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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