| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device capable of preventing the occurrence of polishing unevenness such as insufficient polishing or excessive polishing on a surface to be polished of a substrate and the configuration apparatus.SOLUTION: A holding mechanism of a polishing head 13 holds a substrate W to be a polishing object so that the surface to be polished is brought into sliding contact with a polishing pad 12. The holding mechanism includes a CNT sheet to be a slide regulation member 145. The CNT sheet abuts on a back face of the surface to be polished of the substrate W held by the holding mechanism and makes frictional force generated between the back face of the surface to be polished and the holding mechanism higher than frictional force generated between the polishing pad 12 and the surface to be polished in polishing, thereby regulating the relative movement of the substrate W in a horizontal direction to the holding mechanism. |
