| 摘要 |
PROBLEM TO BE SOLVED: To diffuse and dissipate the heat of a built-in electronic component in the layer, while thinning the whole component built-in board.SOLUTION: A component built-in board includes a multilayer structure laminating a plurality of unit boards, and incorporating a plurality of electronic components in the lamination direction. The plurality of unit boards includes a first board having a first insulating layer and provided with an opening in which a first electronic component is housed, and an intermediate board adjacent to the first board and including a first wiring layer formed on the surface of a second insulating layer on the first board side, and a first adhesive layer provided at least on the first board side of the second insulating layer. The first wiring layer of the intermediate board and the first electronic component are arranged to face via a first adhesive layer and laminated. |
